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Programmers

SUPERPRO-SB03
SUPERPRO-SB03-1
SUPERPRO-SB03-2
SUPERPRO-SB03-3
SUPERPRO-SB03-4
SUPERPRO-SB03-5
SUPERPRO-SB03-6

※ High throughput up to 2400UPH

※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices

※ Supports over 80,000 devices from over 300 IC manufacturers

※ Supports tray, tape and tube input and output. Supports laser and ink marking

※ Short change-over time

※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job

※ Compact size High throughput:4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices.

Prog. Time (S)  50  60  120  180  240  300

UPH (unit per hours)  1600  1600  840  560  420  336

Accurate positioning: Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.

High performance programmers: 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 80,000 devices from over 300 IC manufacturers and growing.

Varied I/O devices:Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.

Short change-over time:I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.

Powerful and intelligent software:Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.

Remote Control:Remote project loading, quality monitoring, volume control, file security.

Motion Sytem

High precision servo drive system.

Resolution:

X axis: ±0.02mm;

Y axis: ±0.02mm;

Z axis: ±0.02mm;

θaxis: ±0.1°

 

Stroke:

X axis: 1000mm;

Y axis: 500mm;

Z axis: 40mm;

 

Pick & Place header accuracy: ±0.07mm

Operable chip size: min: 2x2mm; max: 25x25mm

Maximum Throughput:2400UPH

Vision Sytem

Two CCD cameras. Upward CCD for IC positioning while the  downward CCD for sockets / pick & place spots positioning. 512×512 pixels

Field of view: 30mmX30mm

Vision accuracy: △x=△y=0.07 mm,  △θ=0.1°

 

Programmer

Eight ultra-high speed universal gang programmers SuperPro/7500 resident. Speed much higher than SuperPro/5000. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 80,000 devices from over 300 IC manufacturers. Supports device voltages as low as 1.2V.

 

Control System

Built-in Industrial PC with OS Windows XP, 19” LCD display, keyboard and mouse. Communication interface: USB and LAN.

I/O Devices

Accessories

Programming adaptors, nozzles, socket pressing plates.

 

Electrical and Mechanical Specification

Power Supply: AC 200~240V/50~60Hz, single phase

Power Consumption: 1.5KVA

Air: Clean, pressure: 0.6MPa, consumption: 50 liter/min.

Size(mm): Main machine:  1280(L)×840(W)×1500(H)

Auto tray: 1100(L)×380(W)×1300(H)

Tape-out: 1100(L)×380(W)×1300(H)

 

 Weight(Kg):

Main machine: 450

Auto tray: 80

Tape-out: 80

 

Features:

Manual Tray (Standard equipped)  One tray each time. Change tray manually.

Tape-out Device , Heat sealing and pressure sealing modes. Tape width adjustable between 8 and 32mm.

Tape-In Device , YAMAHA pneumatic feeder. Tape width between 8 and 32mm applicable.

Auto Tray Device, Moves blank tray in and passed tray out the machine automatically, marking the tray (optional). Stack up to 15 JEDEC trays.  

Tube-In Device, Moves chips in the machine. Chip guider for different chip width optional.  

Tube-Out Device, Moves chips out the machine. Chip guider for different chip width optional.  

Tape Ink-Marker, An attachment to the tape-out device. Put a ink dot on the chip.

Auto Tray Ink-Marker, An attachment to the auto tray device. Scan and put dots on the passed chips.

Laser-Marker, An optional attachment to the tape-out or the auto tray device. Marks up to 4 characters on the passed chips.

Price: -

All orders received before noon Beijing Time will begin processing the same business day. 

 

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

 

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase. 

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

 

Hardware & Electrical Specifications: 

Supported devices: ---- .

Packages supported: ---.

PC interface: USB2.0,LAN

Stand-alone Feature: None .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output AC 220V ; power:2000W

Mechanical parameter: Main unit: Size: 1280(L)×840(W)×1500(H) (mm) mm Weight: 400Kg.

Packing Box: Size - mm Weight: - Kg. Detailed

※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders


Post time: Dec-01-2020